Integrated circuit anti-bridging leads design

Details Integrated circuit anti-bridging leads design Integrated circuit anti-bridging leads design

1997-08-20

1998-12-01

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257696, 257779, H01L 2348

Patent

active

058443088

ABSTRACT:
An IC package design and method of making the package design that provides anti-bridging between metal leads. The anti-bridge IC package design extends bottom covercoat material out onto the leads a sufficient distance to prevent solder bridging that typically takes place in cup regions of gull wing shaped leads. A further feature of the invention is to provide a method of applying covercoat material to the IC and the leads in the same process step. A resilient material wheel and related manufacturing equipment is used to apply a single covercoat material, like epoxy, in a single step that serves as both the bottom covercoat and lead anti-bridge coat for the IC.

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