Integrated circuit and supply decoupling capacitor therefor

Details Integrated circuit and supply decoupling capacitor therefor Integrated circuit and supply decoupling capacitor therefor

1997-11-21

1999-04-20

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257665, 257676, 257700, 257924, 257706, H01L 2348, H01L 2352

Patent

active

058959661

ABSTRACT:
An integrated circuit assembly is formed with an integral power supply decoupling capacitor for monolithic circuitry in a semiconductor substrate by using the substrate itself as one plate of the capacitor. A dielectric is formed on the "back" side, or surface, of the substrate (i.e., the surface opposite the surface in which component structures are formed) such as by growing a native oxide thereon. Using a conductive epoxy, the back side of the substrate (actually, the dielectric layer thereon) is then attached to a conductive foundation member, which forms the other plate of the capacitor when a potential is applied across the substrate and the foundation member. The conductive foundation member also may be connected to a heat sink structure integral with the package. The heat sink may extend through a window in the package, providing a path and surface via which heat may be transferred to an external heat sink if a larger heat sink mass is needed. For safety, the heat sinks and the die attach paddle may be maintained at a suitable potential, such as ground, while the substrate can be at another supply potential.

REFERENCES:
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patent: 5386141 (1995-01-01), Liang et al.
patent: 5468994 (1995-11-01), Pendse
patent: 5508556 (1996-04-01), Lin
Karnezos, Marcos et al, "EDQUAD-An Enhanced Performance Plastic Package", IEEE, Jan. 5, 1994, pp. 63-66.

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