Inner-digitized bond fingers on bus bars of semiconductor device

Details Inner-digitized bond fingers on bus bars of semiconductor device Inner-digitized bond fingers on bus bars of semiconductor device

1997-11-26

2000-11-07

Hardy, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257670, 257695, 361813, H01L 23495, H01L 2348

Patent

active

061440892

ABSTRACT:
A semiconductor device package is formed with a lead frame including a plurality of lead members positioned in an array, and a semiconductor die is secured to the lead frame. At least one pair of bus bars is connected to the lead frame and positioned over the semiconductor die, with the bus bars including a plurality of inner-digitized bond fingers. The inner-digitized bond fingers are formed from a series of alternating projections and recesses on each bus bar. A plurality of bond wires electrically couples the lead members to the semiconductor die. Other bond wires electrically couples the inner-digitized bond fingers of the bus bars to the semiconductor die. The bond wires attached to the inner-digitized bond fingers have a substantially uniform loop height and length, providing for easier manufacture and inspection of the semiconductor device package.

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