IC packages including separated signal and power supply edge con

Details IC packages including separated signal and power supply edge con IC packages including separated signal and power supply edge con

1997-09-12

2000-03-28

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257207, 257208, 257679, 257666, 257778, 257693, H05K 720, H01L 2350, H01L 2328, H01L 2348

Patent

active

060435585

ABSTRACT:
A packaging technique for high speed components, such as high speed DRAMS, may involve a package which includes two opposed edges, one edge adapted to receive a power supply and ground contacts which may be ganged together to form a ganged power supply lead and a ganged ground lead. A second edge is arranged to receive normal signal contacts. In this way, the lead inductance may be minimized and the operation efficiency of the package may be improved.

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