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High density package with wrap around interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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High density stacked die assemblies, structures incorporated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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High density three dimensional semiconductor die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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High performance vias for vertical IC packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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IC chip package having chip attached to and wire bonded within a

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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IC interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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IC package with capacitors disposed on an interposal layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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IC stack utilizing secondary leadframes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Implantable medical device construction using a flexible...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated antenna type circuit apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated chip package having intermediate substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated chip package having intermediate substrate and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated chip package having intermediate substrate with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit device having stacked dies and impedance...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit device package having a support coating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit device package having a support coating...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit devices with multi-dimensional pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Integrated circuit devices with stacked package interposers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Integrated circuit devices with stacked package interposers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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