Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2008-09-09
2008-09-09
Weiss, Howard (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S778000, C257SE23010
Reexamination Certificate
active
10707208
ABSTRACT:
An apparatus and method for increasing integrated circuit device package reliability is disclosed. According to one embodiment of the present invention, a support coating is added to a wafer after solder bumps have been added but prior to dicing. This support coating or underfill layer provides added strength to the eventual reflowed solder connections, such that the operational lifetime of these connections is increased with respect to failure due to temperature cycling.
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Kelkar Nikhil K.
Mostafazadeh Shahram
Nguyen Hau
Patwardhan Viraj A.
Beyer Law Group LLP
National Semiconductor Corporation
Trinh Hoa B
Weiss Howard
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