Back-to-back semiconductor device assemblies
Ball grid array package construction with raised solder ball...
Ball grid array package stacking system
Ball grid array package with shielding
Ball grid array package with stacked center pad chips and...
Ball grid array package, stacked semiconductor package and...
Ball grid array packages for high speed applications
Ball grid array substrate having window and method of...
Barrier structure against corrosion and contamination in...
Bond pad rerouting element, rerouted semiconductor devices...
Bridge stack integrated circuit package system
Bridges for interconnecting interposers in multi-chip...
Bumping technology in stacked die configurations
Bumpless chip package
Bumpless chip package