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Vertical ball grid array integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Vertical electrical interconnections in a stack

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Vertical interconnect process for silicon segments

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Vertical interconnect process for silicon segments

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Vertical interconnect process for silicon segments with thermall

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Vertical interconnect process for silicon segments with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Vertical packaged IC device modules with interconnected 3D...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Vertical stack type multi-chip package having improved...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Vertical surface mount package utilizing a back-to-back...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Vertically stacked memory chips in FBGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Vertically stacked pre-packaged integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Vertically stacked semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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