Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2007-05-01
2007-05-01
Pham, Hoai (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257S730000, C257S784000
Reexamination Certificate
active
10059739
ABSTRACT:
A high density electronic circuit for use in an implantable stimulation device that comprises a flexible substrate that has the advantage of integrating “chip-and-wire” microelectronic circuits and flexible interconnections that are adapted to conform to the body compatible housing into a single structure. The flexible substrate has die attach pads, each die attach pad having a set of wire bond pads therearound, each wire bond pad being connected to conductors formed within the substrate according to circuit function. A plurality of chip-and-wire integrated circuit (IC) chips are mounted by epoxy die attachment on the die attach pads, each IC chip has a plurality of contact pads formed on a top surface thereof, and gold wire bonds electrically connect the plurality of contact pads to the wire bonds pads. The wire bonds include a primary bond and, optionally, a safety bond for reinforcement. Other techniques are disclosed to enable the use of the gold wire bonds on a flexible substrate.
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Davis Dion F.
Mouchawar Gabriel A.
Weinberg Alvin H.
Nguyen DiLinh
Pacesetter Inc.
Pham Hoai
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