LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,Multiple housings

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Package in package (PiP)

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package in package device for RF transceiver module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package in package semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package on package design to improve functionality and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package on package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package on-package secure module having BGA mesh cap

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package stacked semiconductor device having pin linking means

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package stacking system with mold contamination prevention

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure for accommodating thicker semiconductor unit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structure stacking chips on front surface and back...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Package structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaged microdevices and methods for manufacturing packaged...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaged microelectronic devices and methods for assembling...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaged microelectronic devices and methods for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaged semiconductor device assembly including two interconnec

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaged stacked semiconductor die and method of preparing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packages for electronic devices implemented with laminated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging for multi-processor shared-memory system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging for semiconductor logic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Packaging method of a plurality of chips stacked on each...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

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