Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2011-04-19
2011-04-19
Arroyo, Teresa M (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S786000, C257SE25013, C257SE21614
Reexamination Certificate
active
07928549
ABSTRACT:
Integrated circuits with multi-dimensional pad structures are provided. An exemplary embodiment of an integrated circuit device with multi-dimensional pad structures comprises an integrated circuit (IC) stack structure comprising a plurality of device layers, wherein one of the devices comprise a first pad exposed by an edge surface thereof.
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Chen Hai-Ching
Hsiung Harold C. H.
Lo Henry
Arroyo Teresa M
Birch & Stewart Kolasch & Birch, LLP
Taiwan Semiconductor Manufacturing Co. Ltd.
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