Integrated circuit devices with multi-dimensional pad...

Details Integrated circuit devices with multi-dimensional pad... Integrated circuit devices with multi-dimensional pad...

2011-04-19

2011-04-19

Arroyo, Teresa M (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S786000, C257SE25013, C257SE21614

Reexamination Certificate

active

07928549

ABSTRACT:
Integrated circuits with multi-dimensional pad structures are provided. An exemplary embodiment of an integrated circuit device with multi-dimensional pad structures comprises an integrated circuit (IC) stack structure comprising a plurality of device layers, wherein one of the devices comprise a first pad exposed by an edge surface thereof.

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