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Stacked die assembly having semiconductor die projecting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked die BGA or LGA component assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked die package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked die package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked die semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked die semiconductor device having circuit tape

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked die structure with an underlying copper-topped die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked dual MOSFET package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked electronic component and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked electronic structures including offset substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Stacked flip chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked flip-chip integrated circuit assemblage

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked high density interconnected integrated circuit system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Stacked high mounting density semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Stacked IC

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked integrated chip package and method of making same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Stacked integrated circuit and package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked integrated circuit chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked integrated circuit chip assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stacked integrated circuit package system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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