Stacked integrated circuit chip assembly

Details Stacked integrated circuit chip assembly Stacked integrated circuit chip assembly

2008-09-30

2008-09-30

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23085

Reexamination Certificate

active

11254163

ABSTRACT:
A stacked arrangement of integrated circuit chips are bonded to a lead frame. Two side-by-side integrated circuit chips have bottom contact pads bonded to a lead frame structure having contact terminals. The two side-by-side integrated circuits have top contact pads bonded to an overlying integrated circuit chip. A low profile integrated circuit assembly is achieved without using bond wires or preforms, and which is well adapted for SO-8 packages.

REFERENCES:
patent: 3609512 (1971-09-01), Lewis
patent: 3978514 (1976-08-01), Ogawa et al.
patent: 3982268 (1976-09-01), Anthony et al.
patent: 5008602 (1991-04-01), Stevens et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5279991 (1994-01-01), Minahan et al.
patent: 5281846 (1994-01-01), Kaiser
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5326994 (1994-07-01), Giebel et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5422435 (1995-06-01), Takiar et al.
patent: 6259123 (2001-07-01), Kelberlau et al.
patent: 6407456 (2002-06-01), Ball
patent: 6580789 (2003-06-01), Simpson et al.
patent: 6876742 (2005-04-01), Sacca
patent: 7224052 (2007-05-01), Nishizawa et al.
patent: 7266195 (2007-09-01), Dupuis et al.
patent: 2004/0070050 (2004-04-01), Chi
patent: 2004/0188818 (2004-09-01), Wang
Teccor Electronics P3002SB Device, Top and Bottom Assembly View (undated).
Teccor Electronics B1xx1UA4 6-pin Device, Top and Side Assembly View (undated).
Littelfuse, Inc., SP721 TVS Doiode Arrays, (undated).
Semtech Product Brochure, Low Cap. 3.3 Volt TVS, type LC3-3.3, Oct. 14, 20.
Office Action in U.S. Appl. No. 11/254,162, dated Apr. 8, 2008.
Office Action in U.S. Appl. No. 11/254,164, dated Jan. 28, 2008.
Ya-Chin King et al. Punch Through Transient Voltage Suppressor For Low-Voltage Electronics IEEE Electron Device Letters, vol. 16 No. 7, Jul. 1995, pp. 303-305 http://ieeexplore.ieee.org/iel1/55/8822/00388715.pdf?arnumber=388715.

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