Stacked integrated chip package and method of making same

Details Stacked integrated chip package and method of making same Stacked integrated chip package and method of making same

1996-12-20

1998-09-29

Ostrowski, David

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257676, 257724, 361790, 361820, H01L 2302

Patent

active

058148817

ABSTRACT:
A single leadframe package having stacked integrated chips mounted therein provides multiple electrical functions. The leadframe package construction includes a leadframe die having a substantially smaller outer peripheral dimension than a first integrated circuit chip mounted face down thereon for supporting from below the first integrated chip without obstructing its bond pads. A second integrated circuit is supported from below in a backside to backside configuration by the first integrated circuit without obstructing the bond pads of the second integrated circuit. A plurality of substantially short conductive wires interconnect electrically the first and second integrated circuit chips with selective ones of a plurality of leadframe conductors. An encapsulating material molds the construction into the single leadframe package.

REFERENCES:
patent: 5012323 (1991-04-01), Farnworth
patent: 5296737 (1994-03-01), Nishimura et al.
patent: 5331235 (1994-07-01), Chun
patent: 5347429 (1994-09-01), Kohno et al.
patent: 5438224 (1995-08-01), Papageorge et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5471369 (1995-11-01), Honda et al.
patent: 5479051 (1995-12-01), Waki et al.
patent: 5523608 (1996-06-01), Kitaoka et al.
patent: 5545922 (1996-08-01), Golwalkar et al.
patent: 5640044 (1997-06-01), Takehashi et al.

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