Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-10-19
2008-09-30
Andujar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE23085
Reexamination Certificate
active
07429785
ABSTRACT:
A stacked arrangement of integrated circuit chips are bonded to a lead frame. Two side-by-side integrated circuit chips have bottom contact pads bonded to a lead frame structure having contact terminals. The two side-by-side integrated circuits have top contact pads bonded to an overlying integrated circuit chip. A low profile integrated circuit assembly is achieved without using bond wires or preforms, and which is well adapted for SO-8 packages.
REFERENCES:
patent: 3609512 (1971-09-01), Lewis
patent: 3978514 (1976-08-01), Ogawa et al.
patent: 3982268 (1976-09-01), Anthony et al.
patent: 5008602 (1991-04-01), Stevens et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5279991 (1994-01-01), Minahan et al.
patent: 5281846 (1994-01-01), Kaiser
patent: 5291061 (1994-03-01), Ball
patent: 5323060 (1994-06-01), Fogal et al.
patent: 5326994 (1994-07-01), Giebel et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5422435 (1995-06-01), Takiar et al.
patent: 6259123 (2001-07-01), Kelberlau et al.
patent: 6407456 (2002-06-01), Ball
patent: 6580789 (2003-06-01), Simpson et al.
patent: 6876742 (2005-04-01), Sacca
patent: 7224052 (2007-05-01), Nishizawa et al.
patent: 7266195 (2007-09-01), Dupuis et al.
patent: 2004/0070050 (2004-04-01), Chi
patent: 2004/0188818 (2004-09-01), Wang
Teccor Electronics P3002SB Device, Top and Bottom Assembly View (undated).
Teccor Electronics B1xx1UA4 6-pin Device, Top and Side Assembly View (undated).
Littelfuse, Inc., SP721 TVS Doiode Arrays, (undated).
Semtech Product Brochure, Low Cap. 3.3 Volt TVS, type LC3-3.3, Oct. 14, 20.
Office Action in U.S. Appl. No. 11/254,162, dated Apr. 8, 2008.
Office Action in U.S. Appl. No. 11/254,164, dated Jan. 28, 2008.
Ya-Chin King et al. Punch Through Transient Voltage Suppressor For Low-Voltage Electronics IEEE Electron Device Letters, vol. 16 No. 7, Jul. 1995, pp. 303-305 http://ieeexplore.ieee.org/iel1/55/8822/00388715.pdf?arnumber=388715.
Andujar Leonardo
Chauza, PC Roger N.
Littelfuse Inc.
Soderholm Krista
LandOfFree
Stacked integrated circuit chip assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Stacked integrated circuit chip assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked integrated circuit chip assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3966983