Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-09-15
2010-02-09
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S676000, C257S685000, C257S723000, C257S724000, C257S777000, C257S778000, C257SE23034, C257SE21001, C438S107000, C438S108000, C438S109000
Reexamination Certificate
active
07659608
ABSTRACT:
A stacked die semiconductor package includes a first integrated circuit chip, a first circuit tape coupled to the first integrated circuit chip, a second integrated circuit chip coupled to the first circuit tape, and at least one component coupled to the first circuit tape. The at least one component may include one or more passive components, one or more active components, or a combination of passive and active components. The stacked die semiconductor package can also include a second circuit tape coupled to the second integrated circuit chip and a third integrated circuit chip coupled to the second circuit tape. The stacked die semiconductor package can also include an encapsulant.
REFERENCES:
patent: 5273938 (1993-12-01), Lin et al.
patent: 5463253 (1995-10-01), Waki et al.
patent: 5905639 (1999-05-01), Warren
patent: 6018463 (2000-01-01), Winslow et al.
patent: 6313520 (2001-11-01), Yoshida et al.
patent: 6320257 (2001-11-01), Jayaraj et al.
patent: 6483181 (2002-11-01), Chang et al.
patent: 6531784 (2003-03-01), Shim et al.
patent: 6768190 (2004-07-01), Yang et al.
patent: 6861288 (2005-03-01), Shim et al.
patent: 6940169 (2005-09-01), Jin et al.
patent: 6943057 (2005-09-01), Shim et al.
patent: 6969640 (2005-11-01), Dimaano Jr. et al.
patent: 7005325 (2006-02-01), Chow et al.
patent: 7064430 (2006-06-01), Chow et al.
patent: 7071421 (2006-07-01), Heng et al.
patent: 7166914 (2007-01-01), DiStefano et al.
patent: 7176506 (2007-02-01), Beroz et al.
patent: 7176579 (2007-02-01), Konishi et al.
patent: 7190069 (2007-03-01), Youker et al.
patent: 7201327 (2007-04-01), Park et al.
patent: 7242101 (2007-07-01), Ararao et al.
patent: 7268426 (2007-09-01), Warner et al.
patent: 7304370 (2007-12-01), Imaizumi et al.
patent: 7423885 (2008-09-01), Cady et al.
patent: 7435619 (2008-10-01), Shim et al.
patent: 2001/0011766 (2001-08-01), Nishizawa et al.
patent: 2004/0113271 (2004-06-01), Takahashi et al.
patent: 2005/0001305 (2005-01-01), Kyung
patent: 2005/0090050 (2005-04-01), Shim et al.
patent: 2006/0118937 (2006-06-01), Katagiri et al.
patent: 2006/0145339 (2006-07-01), Yang et al.
patent: 2008/0029867 (2008-02-01), Kim et al.
patent: 2008/0029868 (2008-02-01), Lee et al.
patent: 2008/0150103 (2008-06-01), Wang et al.
Cablao Philip Lyndon R.
Espiritu Emmanuel A.
Filoteo, Jr. Dario S.
Merilo Leo A.
Soward Ida M
Stats Chippac Ltd.
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