Stacked integrated circuit and package system

Details Stacked integrated circuit and package system Stacked integrated circuit and package system

2011-01-25

2011-01-25

Nguyen, Dao H (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

Reexamination Certificate

active

07875966

ABSTRACT:
A stacked integrated circuit and package system including attaching a first top integrated circuit over an upper surface of a top substrate, attaching a second top integrated circuit over a lower surface of the top substrate, forming top electrical connectors on the lower surface of the top substrate, and connecting a bottom package to the top electrical connectors.

REFERENCES:
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patent: 6882056 (2005-04-01), Komiyama et al.
patent: 6893897 (2005-05-01), Sweterlitsch
patent: 6906416 (2005-06-01), Karnezos
patent: 6906424 (2005-06-01), Kinsman
patent: 6921968 (2005-07-01), Chung
patent: 2004/0007771 (2004-01-01), Shin et al.
patent: 2005/0184377 (2005-08-01), Takeuchi et al.
patent: 2006/0033193 (2006-02-01), Suh et al.

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