Stacked electronic component and manufacturing method thereof

Details Stacked electronic component and manufacturing method thereof Stacked electronic component and manufacturing method thereof

2011-08-30

2011-08-30

Ho, Hoang-Quan T (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S724000, C257S729000, C257S730000, C257S731000, C257S784000, C257S787000, C257SE23004, C257SE23005, C257SE23116, C257SE25006, C257SE25013, C257SE25018, C257SE25021, C257SE25027, C257SE23085, C438S109000

Reexamination Certificate

active

08008763

ABSTRACT:
A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed.

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Office Action dated Jun. 7, 2007, from the Chinese Patent Office for corresponding application No. 200510070829X.
Office Action issued by the Chinese Patent Office on May 22, 2009, for Chinese Patent Application No. 2008101097899, and English-language translation thereof.

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