Stacked high mounting density semiconductor devices

Details Stacked high mounting density semiconductor devices Stacked high mounting density semiconductor devices

1995-04-27

1997-02-11

Saadat, Mahshid

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257666, 257692, 257673, H01L 2302, H01L 23495, H01L 2348, H01L 2352

Patent

active

056024207

ABSTRACT:
A semiconductor device is provided with a stack of a plurality of semiconductor elements each having a bump deposited on each of surface electrodes, and a plurality of leads disposed closely adjacent to the stacked semiconductor elements, the leads being bonded to the bumps respectively thereby structurally integrally assembling the plural semiconductor elements.

REFERENCES:
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 4956694 (1990-09-01), Eide
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5198888 (1993-03-01), Sugano et al.

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