Vertically spaced plural microsprings
Vertically staggered bondpad array
Vertically-tolerant alignment using slanted wall pedestal
Very low dielectric constant plasma-enhanced CVD films
Very low effective dielectric constant interconnect...
Via attached to a bond pad utilizing a tapered interconnect
Via barrier layers continuous with metal line barrier layers...
Via bottom contact and method of manufacturing same
Via configurable architecture for customization of analog...
Via connection structure with a compensative area on the...
Via formation in integrated circuit interconnects
Via gouged interconnect structure and method of fabricating...
Via hole having fine hole land and method for forming the same
Via hole structure with a conductive layer formed therein
Via including multiple electrical paths
Via layout with via groups placed in interlocked arrangement
Via plug adapter
Via plug adapter
Via recess in underlying conductive line
Via structure and process for forming the same