Via including multiple electrical paths

Details Via including multiple electrical paths Via including multiple electrical paths

2007-02-27

2007-02-27

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S758000, C257S698000

Reexamination Certificate

active

10740957

ABSTRACT:
A system includes a device having at least one integrated circuit. The integrated circuit further includes a first layer of conductive material, a second layer of conductive material, and a via having multiple electrical paths for interconnecting the first layer of conductive material and the second layer of conductive material. A method for forming a via includes drilling an opening to a depth to expose a first pad and a second pad, lining the opening with a conductive material, and insulating a first portion of the lining in the opening from a second portion of the lining in the opening to form a first electrical path contacting the first pad and a second electrical path contacting the second pad.

REFERENCES:
patent: 3577037 (1971-05-01), Di Pietro et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 5523627 (1996-06-01), Abe et al.
patent: 5949030 (1999-09-01), Fasano et al.
patent: 6518885 (2003-02-01), Brady et al.
patent: 6838774 (2005-01-01), Patti
patent: 2005/0252683 (2005-11-01), Hsu
patent: 2006/0081396 (2006-04-01), Hsu

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