Search
Selected: F

Fabric type semiconductor device package and methods of...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabricating a semiconductor with an insulative coating

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabricating a semiconductor with an insulative coating

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Beam leads
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication of a metalized blind via

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication of integrated circuit inter-level dielectrics using

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication of integrated circuits with borderless vias

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication of metal film stacks having improved bottom...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication of semiconductor devices with air gaps for ultra...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication of transistor having elevated source-drain and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication of wire bond pads over underlying active...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication process for a semiconductor device with...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fabrication process of a semiconductor device having a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Face-down mounted surface acoustic wave device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Face-to-face (FTF) stacked assembly of substrate-on-bare-chip (S

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Face-to-face multi-chip flip-chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fan-out translator for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fanned out interconnect via structure for electronic package...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

FBGA arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Feasible, gas-dielectric interconnect process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fet array for operation at different power levels

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.