Landing pad technology doubled up as local interconnect and bord
Large grain size conductive structure for narrow...
Large scale IC personalization method employing air dielectric s
Large scale integrated circuit device
Large-area nanoenabled macroelectronic substrates and uses...
Laser defined pads for flip chip on leadframe package
Laser process for reliable and low-resistance electrical...
Layered dielectric film structure suitable for gate...
Layered low dielectric constant technology
Layered system with an electrically activatable layer
Layered wiring line of silver alloy and method for forming...
Layout structure of electrostatic discharge protection circuit
Ldmos transistor with thick copper interconnect
Lead frame and method for plating the same
Lead structure for a semiconductor device with an isolating prot
Lead-free alloys for column/ball grid arrays, organic...
Lead-free interconnection for electronic devices
Lead-free semiconductor package
Lead-free, high tin, ternary solder alloy of tin, bismuth, and i
Light emitting device and method of manufacturing the same