Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate
2005-07-12
2005-07-12
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
C257S703000, C257S775000, C257SE21508, C228S056300
Reexamination Certificate
active
06917113
ABSTRACT:
A lead free solder hierarchy structure for electronic packaging that includes organic interposers. The assembly may also contain passive components as well as underfill material. The lead free solder hierarchy also provides a lead free solder solution for the attachment of a heat sink to the circuit chip with a suitable lead free solder alloy.
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Farooq Mukta G.
Interrante Mario J.
Cioffi James J.
Clark Jasmine
International Business Machines Corporatiion
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