Lead structure for a semiconductor device with an isolating prot

Details Lead structure for a semiconductor device with an isolating prot Lead structure for a semiconductor device with an isolating prot

1997-11-26

2000-09-26

Williams, Alexander O.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257666, 257769, 257753, 257766, 257768, 257698, 257671, H01L 2350, H01L 2152

Patent

active

061246425

ABSTRACT:
A lead structure is provided in a semiconductor device, having a body of a lead having at least a part of which is in contact with an adhesive which bonds with an insulation tape, and a protection layer selectively provided on the body of the lead so that the protection layer coats at least the part of the body in contact with the adhesive to completely isolate the body of the lead from the adhesive, to prevent an ion migration of a material of the body and also to prevent leakage of currents from and into the body of the lead.

REFERENCES:
patent: 4125441 (1978-11-01), Dugan
patent: 4141782 (1979-02-01), Dugan et al.
patent: 4715235 (1987-12-01), Fukui et al.
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4837184 (1989-06-01), Lin et al.
patent: 4974057 (1990-11-01), Tazima
patent: 4997517 (1991-03-01), Parthasarathi
patent: 5049718 (1991-09-01), Spletter et al.
patent: 5067005 (1991-11-01), Michii et al.
patent: 5069626 (1991-12-01), Patterson et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5173766 (1992-12-01), Long et al.
patent: 5227232 (1993-07-01), Lim
patent: 5229329 (1993-07-01), Chai et al.
patent: 5268331 (1993-12-01), Abbott
patent: 5276351 (1994-01-01), Yamazaki et al.
patent: 5326990 (1994-07-01), Mita et al.
patent: 5343073 (1994-08-01), Parthasarathi et al.
patent: 5508401 (1996-04-01), Segawa et al.
patent: 5608260 (1997-03-01), Carper et al.
patent: 5659198 (1997-08-01), Okutoho et al.
patent: 5723900 (1998-03-01), Kojima et al.
patent: 5737191 (1998-04-01), Horiuchi et al.
patent: 5793099 (1998-08-01), Murukami et al.

Affiliated with

Also associated with

Rating

Lead structure for a semiconductor device with an isolating prot does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead structure for a semiconductor device with an isolating prot, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead structure for a semiconductor device with an isolating prot will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2102666