Lead-free, high tin, ternary solder alloy of tin, bismuth, and i

Details Lead-free, high tin, ternary solder alloy of tin, bismuth, and i Lead-free, high tin, ternary solder alloy of tin, bismuth, and i

1994-03-02

1995-05-09

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257779, H01L 2348, H01L 2946, H01L 2964

Patent

active

054143039

ABSTRACT:
Disclosed is a high solidus temperature, high service temperature, high strength ternary solder alloy. The components of the alloy are a major portion of Sn and lesser portions of Bi, and In.

REFERENCES:
patent: 4947238 (1990-08-01), Ishii et al.
patent: 5296649 (1994-03-01), Kosuga et al.

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