Lead-free semiconductor package

Details Lead-free semiconductor package Lead-free semiconductor package

2007-05-08

2007-05-08

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S779000, C257S697000, C257S778000, C257S780000, C257SE23023, C420S562000

Reexamination Certificate

active

11167425

ABSTRACT:
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

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Ning-Cheng Lee, “Lead-free soldering and low alpha solders for wafer level interconnects”, vol. XP009075177, Sep. 2000.

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