Microelectronic interconnect material with adhesion...
Microelectronic package comprising tin-copper solder bump interc
Microelectronic package interconnect and method of...
Microelectronic structure including dual damascene structure...
Microfeature workpieces having conductive interconnect...
Microprocessor having air as a dielectric and encapsulated...
Microstructure liner having improved adhesion
Microstructure modification in copper interconnect structure
Miniaturized contact in semiconductor substrate and method...
MIS semiconductor device with polysilicon gate electrode
Misfet semiconductor device having different vertical levels
MOCVD formation of Cu2S
Modified gold-tin system with increased melting temperature...
Modified multilayered metal line structure for use with tungsten
Modified via bottom structure for reliability enhancement
Moisture-proof electrical circuit high density interconnect modu
Mold type semiconductor device
Moldless semiconductor device and photovoltaic device module...
Molybdenum boride barrier layers between aluminum and silicon at
MOS gate structure semiconductor device