Moisture-proof electrical circuit high density interconnect modu

Details Moisture-proof electrical circuit high density interconnect modu Moisture-proof electrical circuit high density interconnect modu

1991-11-14

1994-03-01

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

257758, 257759, H01L 2302

Patent

active

052910660

ABSTRACT:
A moisture-proof integrated circuit module includes at least one integrated circuit component in a high density interconnect (HDI) structure fabricated by applying to a substrate successive multiple ply sequences having a plurality of via holes therein. The sequences overlie the component(s) and the module substrate, and each sequence includes a dielectric film and a plurality of lands comprised of metal that extends into the vias of the sequence to provide electrical interconnections. The module includes at least one moisture barrier film to prevent penetration of moisture through the module to the circuit component(s).

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