Microelectronic package comprising tin-copper solder bump interc

Details Microelectronic package comprising tin-copper solder bump interc Microelectronic package comprising tin-copper solder bump interc

1993-10-04

1995-04-25

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

420560, H01R 2348

Patent

active

054101840

ABSTRACT:
A microelectronic package comprises an integrated circuit component mounted on a substrate by solder bump interconnections formed of a lead-free, tin-base solder alloy that contains a significant copper addition. A preferred solder is composed of a tin alloy containing between about 2 and 8 weight percent copper, preferably between about 3 and 5 weight percent. In the absence of lead, it is found that precipitation of copper-containing intermetallics of the type that adversely affect tin-lead solders is reduced. Moreover, the lead-free copper-tin solder alloy exhibits a high surface tension to reduce collapse of component toward the substrate during solder reflow.

REFERENCES:
patent: 4706811 (1987-11-01), Jung et al.
patent: 4758407 (1988-07-01), Ballentine et al.
patent: 5120678 (1993-06-01), Moore et al.
American Society for Metals, "Soldering," Welding Braizing and Soldering,: vol. 6, Metals Handbook, 9th Edition (1983), pp. 1069-1076.

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