Mold type semiconductor device

Details Mold type semiconductor device Mold type semiconductor device

2007-03-20

2007-03-20

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S771000, C257S772000, C257SE23159, C257SE23160

Reexamination Certificate

active

10859130

ABSTRACT:
A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.

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Decision for Refusal issued from Japanese Patent Office issued on Jan. 23, 2006 for the corresponding Japanese patent application No. 2003-178147 (a copy and English translation thereof).
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