Microfeature workpieces having conductive interconnect...

Details Microfeature workpieces having conductive interconnect... Microfeature workpieces having conductive interconnect...

2011-07-05

2011-07-05

Hoang, Quoc H (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23141

Reexamination Certificate

active

07973411

ABSTRACT:
Microfeature workpieces having conductive vias formed by chemically reactive processes, and associated systems and methods are disclosed. A method in accordance with one embodiment includes disposing a conductive lining on walls of a via in a microfeature workpiece, so that a space is located between opposing portions of the lining facing toward each other from opposing portions of the wall. The method can further include chemically reacting the lining with a reactive material to form a chemical compound from a constituent of the reactive material and a constituent of the lining. The method can still further include at least partially filling the space with the compound. In particular embodiments, the conductive lining includes copper, the reactive material includes sulfur hexafluoride, and the chemical compound that at least partially fills the space in the via includes copper sulfide.

REFERENCES:
patent: 2821959 (1958-02-01), Franz
patent: 3006318 (1961-10-01), Monroe, Jr. et al.
patent: 3345134 (1967-10-01), Heymer et al.
patent: 3865298 (1975-02-01), Allen et al.
patent: 3902036 (1975-08-01), Zaleckas
patent: 4040168 (1977-08-01), Huang
patent: 4368106 (1983-01-01), Anthony
patent: 4534100 (1985-08-01), Lane
patent: 4581301 (1986-04-01), Michaelson
patent: 4608480 (1986-08-01), Bizot et al.
patent: 4614427 (1986-09-01), Koizumi et al.
patent: 4627971 (1986-12-01), Ayer
patent: 4660063 (1987-04-01), Anthony
patent: 4756765 (1988-07-01), Woodroffe
patent: 4768291 (1988-09-01), Palmer
patent: 4818728 (1989-04-01), Rai et al.
patent: 4907127 (1990-03-01), Lee
patent: 4959705 (1990-09-01), Lemnios et al.
patent: 4964212 (1990-10-01), Deroux-Dauphin et al.
patent: 4984597 (1991-01-01), McConnell et al.
patent: 5024966 (1991-06-01), Dietrich et al.
patent: 5026964 (1991-06-01), Somers et al.
patent: 5027184 (1991-06-01), Soclof
patent: 5037782 (1991-08-01), Nakamura et al.
patent: 5123902 (1992-06-01), Muller et al.
patent: 5145099 (1992-09-01), Wood et al.
patent: 5158911 (1992-10-01), Quentin et al.
patent: 5219344 (1993-06-01), Yoder, Jr.
patent: 5233448 (1993-08-01), Wu et al.
patent: 5237148 (1993-08-01), Aoki et al.
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5292686 (1994-03-01), Riley et al.
patent: 5294568 (1994-03-01), McNeilly et al.
patent: 5304743 (1994-04-01), Sen et al.
patent: 5378312 (1995-01-01), Gifford et al.
patent: 5378313 (1995-01-01), Pace
patent: 5380681 (1995-01-01), Hsu et al.
patent: 5402435 (1995-03-01), Shiono et al.
patent: 5406630 (1995-04-01), Piosenka et al.
patent: 5424573 (1995-06-01), Kato et al.
patent: 5438212 (1995-08-01), Okaniwa et al.
patent: 5447871 (1995-09-01), Goldstein
patent: 5464960 (1995-11-01), Hall et al.
patent: 5481483 (1996-01-01), Ebenstein
patent: 5496755 (1996-03-01), Bayraktaroglu
patent: 5515167 (1996-05-01), Ledger et al.
patent: 5518956 (1996-05-01), Liu et al.
patent: 5585308 (1996-12-01), Sardella
patent: 5585675 (1996-12-01), Knopf
patent: 5614743 (1997-03-01), Mochizuki et al.
patent: 5618752 (1997-04-01), Gaul
patent: 5624437 (1997-04-01), Freeman et al.
patent: 5627106 (1997-05-01), Hsu et al.
patent: 5646067 (1997-07-01), Gaul
patent: 5654221 (1997-08-01), Cronin et al.
patent: 5673846 (1997-10-01), Gruber
patent: 5684642 (1997-11-01), Zumoto et al.
patent: 5690841 (1997-11-01), Elderstig et al.
patent: 5718791 (1998-02-01), Spengler et al.
patent: 5723904 (1998-03-01), Shiga
patent: 5726493 (1998-03-01), Yamashita et al.
patent: 5771158 (1998-06-01), Yamagishi et al.
patent: 5773359 (1998-06-01), Mitchell et al.
patent: 5776824 (1998-07-01), Farnworth et al.
patent: 5807439 (1998-09-01), Akatsu et al.
patent: 5811799 (1998-09-01), Wu
patent: 5821532 (1998-10-01), Beaman et al.
patent: 5825080 (1998-10-01), Imaoka et al.
patent: 5826628 (1998-10-01), Hamilton
patent: 5847454 (1998-12-01), Shaw et al.
patent: 5851845 (1998-12-01), Wood et al.
patent: 5857963 (1999-01-01), Pelchy et al.
patent: 5861654 (1999-01-01), Johnson
patent: 5870289 (1999-02-01), Tokuda et al.
patent: 5870823 (1999-02-01), Bezama et al.
patent: 5893828 (1999-04-01), Uram
patent: 5904499 (1999-05-01), Pace
patent: 5969422 (1999-10-01), Ting et al.
patent: 5998240 (1999-12-01), Hamilton et al.
patent: 5998292 (1999-12-01), Black et al.
patent: 6004867 (1999-12-01), Kim et al.
patent: 6008070 (1999-12-01), Farnworth
patent: 6008914 (1999-12-01), Sasagawa et al.
patent: 6080291 (2000-06-01), Woodruff et al.
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6103547 (2000-08-01), Corisis et al.
patent: 6107180 (2000-08-01), Munroe et al.
patent: 6107679 (2000-08-01), Noguchi
patent: 6110825 (2000-08-01), Mastromatteo et al.
patent: 6114240 (2000-09-01), Akram et al.
patent: 6119335 (2000-09-01), Park et al.
patent: 6124634 (2000-09-01), Akram et al.
patent: 6130141 (2000-10-01), Degani et al.
patent: 6133622 (2000-10-01), Corisis et al.
patent: 6137182 (2000-10-01), Hause et al.
patent: 6140604 (2000-10-01), Somers et al.
patent: 6143588 (2000-11-01), Glenn
patent: 6148509 (2000-11-01), Schoenfeld et al.
patent: 6159764 (2000-12-01), Kinsman et al.
patent: 6180518 (2001-01-01), Layadi et al.
patent: 6184060 (2001-02-01), Siniaguine
patent: 6184465 (2001-02-01), Corisis
patent: 6187615 (2001-02-01), Kim et al.
patent: 6191487 (2001-02-01), Rodenbeck et al.
patent: 6203539 (2001-03-01), Shimmick et al.
patent: 6221769 (2001-04-01), Dhong et al.
patent: 6222136 (2001-04-01), Appelt et al.
patent: 6222270 (2001-04-01), Lee et al.
patent: 6228687 (2001-05-01), Akram et al.
patent: 6229202 (2001-05-01), Corisis
patent: 6235552 (2001-05-01), Kwon et al.
patent: 6246108 (2001-06-01), Corisis et al.
patent: 6252300 (2001-06-01), Hsuan et al.
patent: 6268114 (2001-07-01), Wen et al.
patent: 6271580 (2001-08-01), Corisis
patent: 6277757 (2001-08-01), Lin et al.
patent: 6291894 (2001-09-01), Farnworth et al.
patent: 6294837 (2001-09-01), Akram et al.
patent: 6297155 (2001-10-01), Simpson et al.
patent: 6324253 (2001-11-01), Yuyama et al.
patent: 6326689 (2001-12-01), Thomas
patent: 6326697 (2001-12-01), Farnworth
patent: 6329632 (2001-12-01), Fournier et al.
patent: 6341009 (2002-01-01), O'Connor et al.
patent: 6344976 (2002-02-01), Schoenfeld et al.
patent: 6359254 (2002-03-01), Brown
patent: 6359328 (2002-03-01), Dubin
patent: 6372548 (2002-04-01), Bessho et al.
patent: 6388208 (2002-05-01), Kiani et al.
patent: 6391770 (2002-05-01), Kosaki et al.
patent: 6406636 (2002-06-01), Vaganov
patent: 6432821 (2002-08-01), Dubin et al.
patent: 6433303 (2002-08-01), Liu et al.
patent: 6433304 (2002-08-01), Okumura et al.
patent: 6437284 (2002-08-01), Okamoto et al.
patent: 6437441 (2002-08-01), Yamamoto et al.
patent: 6441487 (2002-08-01), Elenius et al.
patent: 6444576 (2002-09-01), Kong
patent: 6452270 (2002-09-01), Huang et al.
patent: 6457515 (2002-10-01), Vafai et al.
patent: 6459039 (2002-10-01), Bezama et al.
patent: 6459150 (2002-10-01), Wu et al.
patent: 6468889 (2002-10-01), Iacoponi et al.
patent: 6486083 (2002-11-01), Mizuno et al.
patent: 6486549 (2002-11-01), Chiang et al.
patent: 6521516 (2003-02-01), Monzon et al.
patent: 6521530 (2003-02-01), Peters et al.
patent: 6534192 (2003-03-01), Abys et al.
patent: 6534863 (2003-03-01), Walker et al.
patent: 6545563 (2003-04-01), Smith
patent: 6555782 (2003-04-01), Isaji et al.
patent: 6560047 (2003-05-01), Choi et al.
patent: 6569711 (2003-05-01), Susko et al.
patent: 6569777 (2003-05-01), Hsu et al.
patent: 6572606 (2003-06-01), Kliewer et al.
patent: 6576531 (2003-06-01), Peng et al.
patent: 6580174 (2003-06-01), McCormick et al.
patent: 6582987 (2003-06-01), Jun et al.
patent: 6582992 (2003-06-01), Poo et al.
patent: 6593644 (2003-07-01), Chiu et al.
patent: 6599436 (2003-07-01), Matzke et al.
patent: 6606251 (2003-08-01), Kenny, Jr. et al.
patent: 6614033 (2003-09-01), Suguro et al.
patent: 6620031 (2003-09-01), Renteln
patent: 6620731 (2003-09-01), Farnworth et al.
patent: 6621045 (2003-09-01), Liu et al.
patent: 6638410 (2003-10-01), Chen et al.
patent: 6653236 (2003-11-01), Wai et al.
patent: 6658818 (2003-12-01), Kurth et al.
patent: 6660622 (2003-12-01), Chen et al.
patent: 6660630 (

Affiliated with

Also associated with

Rating

Microfeature workpieces having conductive interconnect... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microfeature workpieces having conductive interconnect..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microfeature workpieces having conductive interconnect... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2639156