BOC BGA package for die with I-shaped bond pad layout
Bond pad for a flip-chip package
Bond pad for flip chip package
Bond pad for integrated circuit
Bond pad functional layout on die to improve package manufactura
Bond pad having variable density via support and method for...
Bond pad having vias usable with antifuse process technology
Bond pad having vias usable with antifuse process technology
Bond pad option for integrated circuits
Bond pad rerouting element and stacked semiconductor device...
Bond pad rerouting element and stacked semiconductor device...
Bond pad structure for copper metallization having increased...
Bond pad structure for integrated circuit chip
Bond-pad with a single anchoring structure
Bonding pad and chip structure
Bonding pad in semiconductor device
Bonding pad metal layer geometry design
Bonding pad structure
Bonding pad structure
Bonding pad structure of semiconductor device having...