Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1997-11-05
1999-05-18
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257784, 257750, 257767, A01L23/48;23/52
Patent
active
059053089
ABSTRACT:
A bond pad (18, 58) may comprise a base (20, 60) of bondable material. The base (20, 60) may have a periphery (26, 66). A segment of an interconnect (24, 64) may contact an extended section (28, 68) of the periphery (26, 66) to electrically couple the interconnect (24, 64) to the bond pad (18,58). The interconnect (24, 64) may comprise a material less resistive than the bondable material.
REFERENCES:
patent: 3409807 (1968-11-01), Gerstner
patent: 4151545 (1979-04-01), Schnepf et al.
Carter Buford H.
Efland Taylor R.
Williams Charles E.
Arroyo Teresa M.
Brady III W. James
Donaldson Richard L.
Garner Jacqueline J.
Texas Instruments Incorporated
LandOfFree
Bond pad for integrated circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Bond pad for integrated circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Bond pad for integrated circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1761645