Electrical redundancy for improved mechanical reliability in...
Electro-thermal nested die-attach design
Electrode structure of a wiring substrate of semiconductor devic
Electronic component module
Electronic component package
Electronic component with semiconductor chips, electronic...
Electronic device and use thereof
Electronic devices including solder bumps on compliant...
Electronic package with optimized circuitization pattern
Electronic package with strengthened conductive pad
Electrostatic discharge protective schemes for integrated...
Enhanced pad design for substrate
Exposed pad module integrating a passive device therein
External power ring with multiple tapings to reduce IR drop...