Bonding pad and chip structure

Details Bonding pad and chip structure Bonding pad and chip structure

2006-06-20

2006-06-20

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S734000, C257S737000, C257S784000

Reexamination Certificate

active

07064449

ABSTRACT:
A chip structure and a bonding pad are provided. The chip structure comprises a chip and at least a bonding pad. The chip has an active surface. The bonding pad is disposed on the active surface of the chip. The bonding pad comprises a polygonal body and a plurality of first protruding portions. The polygonal body has a first planar surface and a corresponding second planar surface. The second planar surface of the polygonal body is in contact with the chip. The first protruding portions are disposed on the first planar surface at the corner regions of the polygonal body. By modifying the geometric shape of the bonding pad, the yield of bonding the chip structure and another device together through the bonding pad is increased.

REFERENCES:
patent: 5053850 (1991-10-01), Baker et al.
patent: 6246587 (2001-06-01), Chen
patent: 6613662 (2003-09-01), Wark et al.
patent: 6897570 (2005-05-01), Nakajima et al.
patent: 2004/0166661 (2004-08-01), Lei

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