Bond pad option for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

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Details

257321, 257353, 257357, 257392, 257360, 257734, H01L 29788, H01L 2701, H01L 2362

Patent

active

056989032

ABSTRACT:
An integrated circuit having a first and second bond pads, a latch circuit, and a voltage lead. Different configurations of the internal circuitry of the integrated circuit are selected by applying the voltage lead either to the first or second bond pads. This result is achieved because the latch circuit, coupled between the first and second bond pads, is capable of inverting the voltage response seen at the first bond pad.

REFERENCES:
patent: 4985641 (1991-01-01), Nagayama et al.
patent: 5285069 (1994-02-01), Kaibara
patent: 5303180 (1994-04-01), McAdams

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