Package of semiconductor chip with array-type bonding pads
Package-free bonding pad structure
Packaged semiconductor with multiple rows of bond pads and...
Pad over active circuit system and method with frame support...
Pad over active circuit system and method with meshed...
Partially populated ball grid design to accommodate landing...
Pattern and method for measuring alignment error
Perimeter matrix ball grid array circuit package with a...
Photo-definable template for semiconductor chip alignment
Placement of sacrificial solder balls underneath the PBGA...
Power and ground and signal layout for higher density integrated
Power grid layout techniques on integrated circuits
Printed circuit board and soldering structure for electronic...
Printed circuit board having an improved land structure
Progressive staggered bonding pads