Bonding pad metal layer geometry design

Details Bonding pad metal layer geometry design Bonding pad metal layer geometry design

2005-02-22

2005-02-22

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S773000, C257S774000, C257S775000, C257S784000

Reexamination Certificate

active

06858944

ABSTRACT:
A bonding pad suitable for use in wire bonding an integrated circuit includes an approximately rectangular metal pattern. The bonding pad has at least one slot or hole in it, located at or adjacent to at least one corner of the approximately rectangular metal pattern. The slot or hole provides peeling stress relief.

REFERENCES:
patent: 5985765 (1999-11-01), Hsiao et al.
patent: 6087732 (2000-07-01), Chittipeddi et al.
patent: 6165886 (2000-12-01), Lin et al.
patent: 6181016 (2001-01-01), Lin et al.
patent: 6306749 (2001-10-01), Lin
patent: 6313541 (2001-11-01), Chan et al.

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