LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Combined with electrical contact or lead,Configuration or pattern of bonds

Selected: All

All

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9 ! " $ ' ( ) * , - / : < = > ? @ [ \ ] ^ ` { | } ~ €

120 degree bump placement layout for an integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

150 degree bump placement layout for an integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

60 degree bump placement layout for an integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

90 degree bump placement layout for an integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Adapter board and method for manufacturing same, probe card,...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Anisotropic conductive film bonding pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Apparatus and method extending flip-chip pad structures for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Apparatus and method for preventing configurable...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Apparatus for routing die interconnections using...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Area efficient bond pad placement

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Arrangement of conductive pads on grid array package and on...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Assembly of semiconductor device and wiring substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array (BGA) integrated circuit packages

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array module

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array package for providing constant internal...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

Ball grid array to prevent shorting between a power supply...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA land pattern

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Patent

[ 0.00 ] – not rated yet Voters 0 Comments 0

BGA-type multilayer circuit wiring board

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds

Reexamination Certificate

[ 0.00 ] – not rated yet Voters 0 Comments 0

All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

Charities
Companies
MP Candidates
Patents
Employee Salary Disclosure

World

Places of the World
Scientific Papers

United States

Banks
Companies
Counties
Patents
Employee Salary Disclosure