Bond pad for flip chip package

Details Bond pad for flip chip package Bond pad for flip chip package

2005-08-09

2005-08-09

Lam, Cathy F. (Department: 1775)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S698000, C257S773000, C257S784000

Reexamination Certificate

active

06927498

ABSTRACT:
A bond pad for a flip chip package. The bond pad is suitable for an integrated circuit chip. A plurality of slots are designed in the bond pad. Each of the slots extends along a direction which is perpendicular to a radial direction from the center of the bond pad. The bond pad is deposed at the corner of the integrated circuit chip.

REFERENCES:
patent: 5527999 (1996-06-01), Knigga et al.
patent: 5736791 (1998-04-01), Fujiki et al.
patent: 5923088 (1999-07-01), Shiue et al.
patent: 6087732 (2000-07-01), Chittipeddi et al.
patent: 6180265 (2001-01-01), Erickson
patent: 6187658 (2001-02-01), Chittipeddi et al.
patent: 6313540 (2001-11-01), Kida et al.

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