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Electronic device having an electronic component with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electronic device including a conductive stud over a bonding...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electronic device with external contact elements and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electronic device, method of producing the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electronic interface structures and methods of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electronic package interconnect structure comprising...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electronic package with compliant electrically-conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electronic packaging using conductive interproser connector

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electronic structures including barrier layers defining lips

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Electrostatic discharge protection

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Embedded carrier for an integrated circuit chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Encapsulated semiconductor device package having holes for elect

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Enhanced copper posts for wafer level chip scale packaging

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Enhanced pad design for substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Enhanced underfill adhesion

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Etchant formulation for selectively removing thin films in...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Fan-out translator for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Fine pitch low-cost flip chip substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Fixture for handling and attaching conductive spheres to a subst

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Flexible joint methodology to attach a die on an organic...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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