Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-06-29
2009-06-30
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257SE23065, C257SE23067, C257SE23069, C257SE23023, C257SE23068, C257S680000, C257S784000, C257S779000, C257S780000, C257S738000, C257S778000, C257S691000, C257S698000, C257S774000, C257S773000, C257S668000
Reexamination Certificate
active
07554198
ABSTRACT:
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.
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Pending U.S. Appl. No. 11/395,628, filed Mar. 31, 2006, Inventor: Fukuo, et al.
International Search Report for corresponding matter P24212PCT dated Nov. 17, 2007.
Fukuo Tsuyoshi
Ishiyama Seiji
Koh Tetsuhide
Ogata Kazuo
Guglielmi David L.
Intel Corporation
Williams Alexander O
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