Flexible joint methodology to attach a die on an organic...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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C257SE23065, C257SE23067, C257SE23069, C257SE23023, C257SE23068, C257S680000, C257S784000, C257S779000, C257S780000, C257S738000, C257S778000, C257S691000, C257S698000, C257S774000, C257S773000, C257S668000

Reexamination Certificate

active

07554198

ABSTRACT:
In some embodiments, flexible joint methodology to attach a die on an organic substrate is presented. In this regard, an integrated circuit chip package substrate is introduced having an organic substrate, an interposer coupled with a surface of the organic substrate, the interposer having cavities to accept bumps of a die, and a flexible tape layer coupled with a surface of the interposer, the flexible tape layer to couple with bumps of the die. Other embodiments are also disclosed and claimed.

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Pending U.S. Appl. No. 11/395,628, filed Mar. 31, 2006, Inventor: Fukuo, et al.
International Search Report for corresponding matter P24212PCT dated Nov. 17, 2007.

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