Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1994-03-09
1997-03-04
Whitehead, Jr., Carl
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257685, 257686, 257774, 257737, H01L 2348, H01L 2302, H01L 2940
Patent
active
056082657
ABSTRACT:
A semiconductor device, provided in a plastic encapsulated package, having a semiconductor chip, a lead and a member for electrically connecting them together. The semiconductor device has one or more first holes respectively extending from one surface of the package to a first side of the lead which is provided inside of the package, and has one or more second holes formed which are aligned with the first holes, respectively, in a manner such that each second hole is extended from the opposing surface of the package to a corresponding location on a second side of the lead and is aligned with a corresponding, opposing first hole, in the package, extending to the first side of the lead. These holes are provided as a plurality of sets of individual pairs of aligned holes respectively extending inwardly, from opposing surfaces of the package, to opposite sides of the corresponding leads. In the device the leads or the leads with resin act as partitions thereby effecting isolation between the first and second holes of each pair aligned holes.
REFERENCES:
patent: 5045914 (1991-09-01), Castro et al.
patent: 5045921 (1991-09-01), Lin et al.
Kitano Makoto
Kohno Ryuji
Kumazawa Tetsuo
Nishimura Asao
Tanaka Naotaka
Hitachi , Ltd.
Jr. Carl Whitehead
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