Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2006-06-27
2006-06-27
Vu, Hung (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S778000, C257S780000
Reexamination Certificate
active
07067915
ABSTRACT:
An electronic device has external contact elements projecting from at least one external contact side of a plastic housing. The external contact elements have an internal section and an external section. The external section has an external contact region tapering away from the external contact side. An external contact element of this type improves the possibilities of a soldering connection to circuit carriers of superordinate circuits.
REFERENCES:
patent: 5485039 (1996-01-01), Fujita et al.
patent: 5550403 (1996-08-01), Carichner
patent: 6093584 (2000-07-01), Fjelstad
patent: 2002/0053467 (2002-05-01), Gebauer et al.
patent: 2003/0102538 (2003-06-01), Paulus
patent: 100 31 204 (2002-01-01), None
patent: 100 45 534 (2002-04-01), None
patent: 02/01634 (2002-01-01), None
Kilger Thomas
Paulus Stefan
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