Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2008-07-29
2010-11-09
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257SE23142, C257S737000, C257S778000, C257S780000, C438S118000
Reexamination Certificate
active
07830007
ABSTRACT:
A semiconductor device includes n1first interconnects (n is an integer larger than one) respectively formed on first electrodes and extending over a first resin protrusion, and n2second interconnects (n2<n1) respectively formed on second electrodes and extending over a second resin protrusion. The first and second resin protrusions are formed of an identical material, have an identical width, and extend longitudinally. The first interconnects extends to intersect a longitudinal axis of the first resin protrusion, and each of the first interconnects has a first width W1on the first resin protrusion. The second interconnects extends to intersect a longitudinal axis of the second resin protrusion, and each of the second interconnects has a second width W2(W1<W2) on the second resin protrusion. The relationship W1×n1=W2×n2is satisfied.
REFERENCES:
patent: 6277669 (2001-08-01), Kung et al.
patent: 6587353 (2003-07-01), Sumikawa et al.
patent: 6936928 (2005-08-01), Hedler et al.
patent: 7161245 (2007-01-01), Saito
patent: 7312533 (2007-12-01), Haimerl et al.
patent: 7524700 (2009-04-01), Tanaka
patent: 7534652 (2009-05-01), Haba et al.
patent: 7573140 (2009-08-01), Neishi
patent: 7601626 (2009-10-01), Tanaka
patent: 7714436 (2010-05-01), Tanaka
patent: 2005/0006788 (2005-01-01), Kaneko
patent: 2006/0286790 (2006-12-01), Yamasaki et al.
patent: 2007/0001200 (2007-01-01), Imai et al.
patent: 2007/0015363 (2007-01-01), Hashimoto
patent: 2007/0029652 (2007-02-01), Asakawa et al.
patent: 2007/0057371 (2007-03-01), Hashimoto
patent: 2007/0063345 (2007-03-01), Hashimoto
patent: 02-272737 (1990-11-01), None
patent: 2744476 (1998-02-01), None
patent: 2003-338524 (2003-11-01), None
patent: 2007-027307 (2007-02-01), None
patent: 2007-048971 (2007-02-01), None
Ito Haruki
Tanaka Shuichi
Chu Chris
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
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