Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-06-11
1998-12-01
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257778, 22818021, H01L 2348
Patent
active
058443169
ABSTRACT:
Methods for soldering a ball grid array (BGA) integrated circuit package to a printed circuit board. One method includes the steps of applying a solder flux to the conductive surface pads of a printed circuit board and capturing a plurality of solder balls with a separate fixture. The fixture is then placed onto the printed circuit board and the solder balls are released onto the conductive surface pads. The fixture is removed and an integrated circuit package is placed onto the solder balls. Solder flux may be applied to the bottom of the package to adhere the package to the balls. The solder balls are then reflowed to attach the package to the board. The flux provides a bonding agent which maintains the position of the solder balls and package while the solder is being reflowed. Another method includes the step of placing a fixture adjacent to the integrated circuit package so that a plurality of openings in the fixture are aligned with surface pads located on the bottom surface of the package. Solder balls are then placed into the fixture holes, adjacent to the surface pads of the package. The solder is then reflowed and the fixture is removed so that the package and solder balls can be subsequently soldered to a printed circuit board.
REFERENCES:
patent: 4462534 (1984-07-01), Bitaillou et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 5060844 (1991-10-01), Behun et al.
patent: 5118027 (1992-06-01), Braun et al.
patent: 5279045 (1994-01-01), Odashima et al.
patent: 5410806 (1995-05-01), Schneider
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5445313 (1995-08-01), Boyd et al.
patent: 5467913 (1995-11-01), Namekawa et al.
Hansen Joni
Mallik Debendra
Seth Ashok K.
Sugai Neil R.
Intel Corporation
Potter Roy
Thomas Tom
LandOfFree
Fixture for handling and attaching conductive spheres to a subst does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fixture for handling and attaching conductive spheres to a subst, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fixture for handling and attaching conductive spheres to a subst will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2397930