Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate
2005-06-28
2005-06-28
Thomas, Tom (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
C257S738000, C257S700000, C257S698000, C257S758000, C257S690000, C257S786000, C361S760000, C361S764000, C361S773000
Reexamination Certificate
active
06911736
ABSTRACT:
A package substrate that is adapted to receive at least one subject integrated circuit having a subject contact pattern, where the subject integrated circuit is selected from a design set of integrated circuits. The package substrate has an upper surface with electrically conductive bump contacts in a bump array. The bump array is configured to provide electrical connections to all possible integrated circuit contact patterns in the design set of integrated circuits. A lower surface of the package substrate has electrically conductive ball contacts in a ball array. One each of the bump contacts is electrically connected to one each of the ball contacts through the package substrate. An electrically conductive ground plane is disposed between the upper surface and the lower surface. Grounding contacts are disposed adjacent the ball contacts, where the grounding contacts are electrically connected to the ground plane. The grounding contacts are adapted to electrically short a given ball contact to the ground plane when the bump contact electrically connected to the given ball contact is not used by the subject contact pattern of the subject integrated circuit.
REFERENCES:
patent: 5763947 (1998-06-01), Bartley
patent: 6407450 (2002-06-01), Verma et al.
Landau Matthew C
LSI Logic Corporation
Luedeka Neely & Graham P.C.
Thomas Tom
LandOfFree
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