Electronic package with compliant electrically-conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads

Reexamination Certificate

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Details

C257S772000, C257S779000, C257S781000, C257SE23021, C257SE23033, C257SE23069, C438S613000, C228S180220

Reexamination Certificate

active

07825512

ABSTRACT:
An electronic device comprises a device substrate, a plurality of compliant electrically-conductive balls, and a plurality of solder joints that couple the compliant electrically-conductive balls to the device substrate by a reflow process.

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patent: 2007/0145603 (2007-06-01), Jeong

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