Electronic packaging using conductive interproser connector

Details Electronic packaging using conductive interproser connector Electronic packaging using conductive interproser connector

2008-06-10

2008-06-10

Parekh, Nitin (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S702000, C257S778000, C257SE23021

Reexamination Certificate

active

07385288

ABSTRACT:
Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

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